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Eesti Keel
Română
Slovenski2023-06-30
In the electronic bag, the most important thing is the problem of heat sealing.
The heat-sealing temperature has the most direct influence on the heat-sealing strength. The melting temperature of various materials directly determines the minimum heat sealing temperature of the electronic bag.
In the production process, due to various influences such as the heat sealing pressure, the bag making speed and the thickness of the composite substrate, the actual heat sealing temperature is often higher than the melting temperature of the heat sealing material.
The smaller the heat-sealing pressure, the higher the heat-sealing temperature is required; the faster the machine speed, the thicker the surface layer material of the composite film, and the higher the heat-sealing temperature required. If the heat-sealing temperature is lower than the softening point of the heat-sealing material, no matter how the pressure is increased or the heat-sealing time is prolonged, it is impossible to make the heat-sealing layer truly sealed. However, if the heat-sealing temperature is too high, it is easy to damage the heat-sealing material at the weld edge to melt and extrude, resulting in "undercutting" phenomenon, which greatly reduces the heat-sealing strength of the seal and the impact resistance of the electronic bag.
To achieve the ideal heat seal strength, a certain amount of pressure is necessary.